The **ATS-16B-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### ## Technical Specifications | Parameter | Specification Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-16B-76-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 1.17°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 25mm | | **Fin Style** | Straight Fin | --- ### ## Component Breakdown ### 1. The Heat Sink Body The main body is constructed from **Aluminum**. Aluminum is the industry standard for heat sinks due to its high thermal conductivity and lightweight properties. The **Blue Anodized** coating provides two benefits: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Emissivity:** Increases the radiant heat transfer compared to bare aluminum. ### 2. Attachment Mechanism (Push-Pins) The "R0" designation typically refers to the specific attachment kit included. This model uses a **brass push-pin with a stainless steel spring**. * **Mechanism:** The pins snap into pre-drilled holes on the PCB. * **Pressure:** The springs provide consistent downward pressure, ensuring the thermal interface material (TIM) makes perfect contact with the electronic chip. ### 3. Thermal Interface Material (TIM) This specific part number comes pre-applied with **T766 phase change material**. * **Function:** It fills microscopic air gaps between the chip and the heat sink. * **Efficiency:** Phase change materials offer lower thermal resistance than standard pads as they soften at operating temperatures. --- ### ## Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM | 2.76 | | 200 LFM | 1.17 | | 400 LFM | 0.95 | | 600 LFM | 0.81 | --- ### ## Applications This component is commonly used in: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Cooling network switches and routers. * **Power Electronics:** Cooling voltage regulators or small power modules.