The **ATS-16B-77-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of their "pushPIN™" heat sink assembly line, designed for cooling integrated circuits and electronic components. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16B-77-C2-R0 | | **Material** | Aluminum (Body) / Copper (Interface) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 9.30°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Construction The "77" series typically utilizes a **Straight Fin** design, which is optimized for airflow environments. * **Heat Sink Material:** High-grade aluminum provides a balance between weight and thermal conductivity. * **pushPIN™ Attachment:** This system features a flexible, tool-free installation mechanism. It ensures consistent pressure on the processor/chip, which maximizes heat transfer. * **Blue Anodized Coating:** This is not just for aesthetics; anodizing increases surface emissivity and provides corrosion resistance. --- ### 3. Thermal Performance Metrics Thermal performance varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 9.30 | 5.11 | 4.00 | 3.44 | 3.08 | --- ### 4. Key Applications This component is generally used in space-constrained electronic environments, such as: * **Networking Equipment:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **BGA/FPGA Cooling:** Small form-factor chips requiring passive or active airflow cooling. ---