The **ATS-16B-95-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, and power modules. --- ## Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 30.00mm | | **Fin Type** | Fine Pitch (Straight Fin) | --- ## Component Breakdown ### 1. Thermal Management The "C2" in the part number indicates the material and finish (typically aluminum with a specific thermal conductivity rating). The heat sink uses a **Fine-Pitch fin design**, which maximizes surface area to facilitate better heat transfer to the surrounding air via convection. ### 2. Mounting System (pushPIN™) This part utilizes a specific attachment mechanism: * **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. * **Springs:** Provides a precise "compression force" to ensure the heat sink remains in firm contact with the electronic component for optimal thermal conductivity. ### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates that the component comes with **pre-applied thermal interface material**. This eliminates the need for manual application of thermal paste, ensuring a consistent layer between the chip and the heat sink. --- ## Applications This heat sink is commonly found in: * **Networking Hardware:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and power supply modules where vertical space allows for a 30mm height.