The **ATS-16B-96-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic assemblies. --- ### ## Technical Specifications Below are the primary mechanical and thermal properties of this specific part: | Property | Value | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance (Flowing)** | 5.63 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 10.87 °C/W | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm | | **Pitch** | Fine Pitch | --- ### ## Key Electronic & Physical Features 1. **pushPIN™ Attachment:** The part utilizes a specialized push-pin mechanism. This allows for quick, tool-free installation onto a Printed Circuit Board (PCB). The pins are spring-loaded to ensure consistent pressure (TIM compression) against the electronic component (CPU, FPGA, or GPU). 2. **Thermal Interface Material (TIM):** The "C2" in the part number indicates that it comes pre-applied with **T766 phase-change material**. This is crucial for filling microscopic air gaps between the heat sink base and the electronic chip, significantly improving heat transfer efficiency. 3. **Fine Pitch Fin Design:** The fin geometry is optimized for high-performance cooling. The straight-fin design is intended for systems with a directed airflow (active cooling via fans). 4. **Aluminum Construction:** Made from 6063 aluminum, providing a balance between lightweight design and high thermal conductivity. The Blue Anodized finish adds corrosion resistance and increases surface emissivity. --- ### ## Application Use Cases This component is typically found in: * **Networking Hardware:** Switches and routers where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs or controllers. * **Power Electronics:** Transistors or power modules requiring heat dissipation in constrained spaces.