The **ATS-16D-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation on Printed Circuit Boards (PCBs). --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Style** | Straight (Square) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 21.90 °C/W (Unducted @ 100 LFM) | | **Spring Type** | ATS-PPS-04 (Brass/Steel) | --- ## 2. Key Electronic Features ### A. Thermal Interface Material (TIM) The part comes pre-applied with **T766** thermal phase change material. This is critical for electronics because it fills microscopic air gaps between the component (CPU/GPU/FPGA) and the heat sink, ensuring maximum heat transfer. ### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. - **Reliability:** Prevents the heat sink from shifting during vibration or shipping. - **Pressure:** Provides consistent downward force (preload) to optimize the thermal interface performance. - **Ease of Assembly:** Features a flexible attachment mechanism that allows for quick installation on pre-drilled PCB holes. ### C. Low Profile Design With a height of only **10.00mm**, this part is classified as "Low Profile." It is ideal for high-density electronic enclosures, such as 1U servers, telecommunications equipment, and compact embedded systems where vertical space is limited. --- ## 3. Performance Analysis Thermal performance varies based on the airflow (Velocity) within the electronic system: | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 21.90 | 6.60 | 4.00 | 3.00 | | **Ducted Flow (°C/W)** | 4.40 | 2.50 | 2.10 | 1.90 | *Note: Lower °C/W values indicate better cooling efficiency.* --- ## 4. Typical Applications This component is commonly used to cool: 1. **Network Switches:** Cooling ASICs and processors. 2. **Industrial PC (IPC):** Managing heat in fanless or low-airflow environments. 3. **Power Modules:** Dissipating heat from high-current voltage regulators.