Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-16D-03-C2-R0

  • AI
    The **ATS-16D-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (Unducted)** | 15.85 °C/W @ 100 LFM | | **Fin Type** | Fine-Pitch (Straight) | | **Hole Pattern** | 4-Corner / Square | --- ### 2. Key Features * **pushPIN™ Attachment:** Uses a flexible attachment system consisting of a brass or plastic pin and a high-performance compression spring. This ensures a consistent and secure pressure against the component (CPU, GPU, or FPGA). * **High Performance:** The fine-pitch fin design increases the surface area for heat transfer while maintaining a low profile (15mm height). * **Pre-Applied Thermal Interface Material (TIM):** Most units in this series come with a pre-applied thermal pad or phase-change material to ensure maximum thermal conductivity between the chip and the aluminum. * **Durability:** The blue anodized finish provides corrosion resistance and increased emissivity for better radiative cooling. --- ### 3. Thermal Performance Comparison Thermal resistance varies significantly based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 15.85 | | 200 | 1.0 | 5.79 | | 400 | 2.0 | 3.20 | | 600 | 3.0 | 2.33 | --- ### 4. Typical Applications * **Network Switches & Routers:** Cooling internal processing units. * **Industrial PCs:** Cooling embedded chips in space-constrained environments. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators. * **Consumer Electronics:** High-end audio/video processing boards. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific hole-to-hole mounting dimensions for the ATS-16D-03-C2-R0?
    • ⤷ How do I choose between the plastic and brass pushPIN options for this heat sink?
    • ⤷ What is the recommended thermal interface material for high-vibration environments?