ATS-16D-05-C2-R0
AI

The **ATS-16D-05-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "superGRIP" series, designed for cooling high-heat-generating components like CPUs, GPUs, and FPGAs.
### 1. Technical Specifications
| Feature | Description |
| :--- | :--- |
| **Part Number** | ATS-16D-05-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | superGRIP (Clip-on) |
| **Thermal Resistance** | 8.72°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Key Electronic Features
#### A. Thermal Management
The primary purpose of this part is to dissipate heat from integrated circuits (ICs). By increasing the surface area through its 25mm height and straight-fin design, it allows air to pass through more efficiently, lowering the operating temperature of the silicon.
#### B. superGRIP™ Attachment Technology
Unlike traditional heat sinks that may require holes drilled into the PCB (Printed Circuit Board), the **ATS-16D-05-C2-R0** uses a specialized clip system.
* **Frame Clip:** A plastic frame attaches to the component.
* **Spring Clip:** A metal "C" shaped clip applies consistent pressure across the thermal interface.
* **Safety:** This prevents "walking" or shifting of the heat sink during vibration or shipping.
#### C. Blue Anodized Finish
The blue anodization is not just for aesthetics; it provides:
* **Increased Corrosion Resistance:** Protects the aluminum from environmental factors.
* **Electrical Insulation:** The oxide layer is non-conductive, reducing the risk of short circuits if the sink accidentally touches nearby traces.
* **Emissivity:** Slightly improves heat radiation compared to raw aluminum.
---
### 3. Dimensions and Airflow
The "Straight Fin" geometry is optimized for **undirected airflow**. If your electronic casing has a standard intake/exhaust fan setup, the straight fins allow air to travel through the channels with minimal pressure drop.
```text
Dimension Layout:
Width (W): 40mm <----->
Length (L): 40mm
Height (H): 25mm (Extends vertically from the chip)
```
- ⤷
What is the difference between straight fin and cross-cut fin heat sinks?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Can this heat sink be used on BGA packages without mounting holes?