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  • ATS-16D-05-C2-R0

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    The **ATS-16D-05-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "superGRIP" series, designed for cooling high-heat-generating components like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Part Number** | ATS-16D-05-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | 8.72°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of this part is to dissipate heat from integrated circuits (ICs). By increasing the surface area through its 25mm height and straight-fin design, it allows air to pass through more efficiently, lowering the operating temperature of the silicon. #### B. superGRIP™ Attachment Technology Unlike traditional heat sinks that may require holes drilled into the PCB (Printed Circuit Board), the **ATS-16D-05-C2-R0** uses a specialized clip system. * **Frame Clip:** A plastic frame attaches to the component. * **Spring Clip:** A metal "C" shaped clip applies consistent pressure across the thermal interface. * **Safety:** This prevents "walking" or shifting of the heat sink during vibration or shipping. #### C. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * **Increased Corrosion Resistance:** Protects the aluminum from environmental factors. * **Electrical Insulation:** The oxide layer is non-conductive, reducing the risk of short circuits if the sink accidentally touches nearby traces. * **Emissivity:** Slightly improves heat radiation compared to raw aluminum. --- ### 3. Dimensions and Airflow The "Straight Fin" geometry is optimized for **undirected airflow**. If your electronic casing has a standard intake/exhaust fan setup, the straight fins allow air to travel through the channels with minimal pressure drop. ```text Dimension Layout: Width (W): 40mm <-----> Length (L): 40mm Height (H): 25mm (Extends vertically from the chip) ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between straight fin and cross-cut fin heat sinks?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Can this heat sink be used on BGA packages without mounting holes?