The **ATS-16D-08-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance **maxiFLOW™** family of heat sinks designed for cooling integrated circuits (ICs) and other electronic packages. ### Component Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16D-08-C3-R0 | | **Component Type** | Passive Heat Sink | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Brass pins with plastic springs) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Material** | Aluminum (with Blue Anodized finish) | | **Thermal Resistance** | 14.61°C/W (at 200 LFM) | --- ### Detailed Analysis of Parts and Features #### 1. Heat Sink Design (maxiFLOW™) The core of this part is an aluminum heat sink featuring a **fluted fin design**. Unlike standard straight fins, the maxiFLOW™ geometry increases the surface area and encourages more turbulent airflow through the fins, which significantly improves thermal dissipation efficiency. #### 2. Attachment Mechanism: pushPIN™ This part uses the **ATS pushPIN™** system for mounting. This is a critical electronic hardware component that includes: * **Brass Pins:** Provide structural integrity and secure the sink to the PCB holes. * **Compression Springs:** These are "tuned" to provide a specific amount of force (calculated in grams/PSI) to ensure optimal contact between the heat sink and the electronic chip. #### 3. Interface Material (TIM) The "R0" suffix indicates that the part typically comes with a pre-applied **Thermal Interface Material (TIM)**. * This material is a conductive pad or grease that fills microscopic air gaps between the surface of the processor and the base of the heat sink to maximize heat transfer. #### 4. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and light weight. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves the emissivity (radiation heat transfer) of the component. --- ### Technical Usage Summary This component is typically used in industrial or networking equipment where a 45mm chip (such as an FPGA, GPU, or CPU) requires active airflow cooling. The **C3** designation in the part number refers to a specific spring force and pin material configuration optimized for high-vibration or high-reliability environments.