The **ATS-16D-10-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions** | 45mm x 45mm x 25mm | | **Fin Pattern** | XCUT (Cross-cut) | | **Thermal Resistance** | ~7.89°C/W (Unducted Flow @ 100 LFM) | --- ### Key Electronic & Mechanical Characteristics #### 1. Thermal Management The primary purpose of this part is **passive cooling**. By increasing the surface area of a heat-generating semiconductor, it allows heat to dissipate into the surrounding air via convection. The "XCUT" fin design allows air to flow through the fins from multiple directions, making it efficient in systems with variable airflow. #### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the ATS-16D-10-C2-R0 uses a mechanical **push-pin and spring** system: * **Reliability:** Provides constant pressure (preload) on the thermal interface material (TIM). * **Ease of Install:** Snaps into pre-drilled holes on the PCB (Printed Circuit Board). * **Springs:** The "R0" designation typically refers to the specific spring tension provided to ensure optimal contact without damaging the chip. #### 3. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides a small amount of electrical insulation and improves corrosion resistance. --- ### Applications * **Integrated Circuits (ICs):** Cooling FPGAs, ASICs, or Processors. * **Power Electronics:** Dissipating heat from large voltage regulators. * **Network Equipment:** Used in switches and routers where airflow is provided by system fans. ---