The **ATS-16D-115-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications Below are the primary technical attributes of this part: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.33°C/W (at 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (Off Base)** | 20mm | | **Attachment Method** | Push Pin (Spring Loaded) | | **Fin Style** | XC (Extra Coarse) / Square Pin | --- ### 2. Breakdown of the Part Number The part number follows the standard ATS nomenclature: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **16D**: Refers to the specific fin pattern and series (XC/Push-Pin). * **115**: Internal design/size code (40mm x 40mm x 20mm). * **C2**: Indicates the material/finish (Aluminum with Blue Anodized coating). * **R0**: Version or revision code. --- ### 3. Key Electronic Functions The ATS-16D-115-C2-R0 serves several critical roles in an electronic assembly: * **Heat Dissipation:** It increases the surface area of a hot component (like a CPU, FPGA, or GPU), allowing air to carry away heat more efficiently. * **Thermal Protection:** By maintaining the junction temperature within safe limits, it extends the lifespan of the semiconductor. * **Mechanical Stability:** The "Push Pin" mechanism ensures constant pressure between the heat sink and the chip, which is vital for the effectiveness of the Thermal Interface Material (TIM). --- ### 4. Component Diagram / Layout ```mermaid graph TD A[Push Pin Attachment] --> B[Spring Loading] B --> C[Aluminum Base] C --> D[Heat Source/Chip] C --> E[Square Fin Array] E --> F[Airflow Cooling] ``` ---