The **ATS-16D-121-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for cooling electronic components like CPUs, GPUs, or power modules. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body), Blue Anodized (Finish) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 10mm (Low Profile) | | **Fin Pattern** | Fine-Pitch, Straight Fin | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 9.48°C/W (Unducted Flow @ 1.0 m/s) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### ## Component Breakdown ### 1. The Heat Sink Body The unit uses a **Straight Fin** design. Straight fins are ideal for environments where airflow is directed through the fins in a linear path. Because the height is only **10mm**, it is classified as a low-profile heat sink, making it suitable for 1U servers or slim electronic enclosures. ### 2. Attachment Mechanism (pushPIN™) Instead of using adhesive tape or simple clips, this model uses a **pushPIN™** system: * **Brass Push Pin:** Provides secure attachment to the PCB. * **Stainless Steel Spring:** Ensures consistent downward pressure, which is critical for maintaining thermal contact between the chip and the heat sink. * **Compression:** Specifically calculated to provide the optimal "Force-to-Deflection" ratio. ### 3. Thermal Interface Material (TIM) The part number suffix **C2** indicates the type of thermal grease/pad pre-applied to the base. * **T766:** A high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic component to maximize heat transfer. ### 4. Material Finish The **Blue Anodized** finish is not just for aesthetics; it provides: * Increased surface area at a microscopic level. * Improved corrosion resistance. * Enhanced radiative heat transfer. --- ### ## Application Context This specific part is generally used in: * **Embedded Systems:** Industrial PCs where space is limited. * **Telecommunications:** Cooling of ASICs or FPGAs. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.