The **ATS-16D-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.28°C/W (at 100 LFM) | | **Dimensions (L x W)** | 50.00mm x 50.00mm | | **Height** | 25.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Style** | Fine Pitch (Cylindrical/Square pillars) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's features: - **ATS**: Advanced Thermal Solutions (Manufacturer). - **16D**: Refers to the specific series and fin configuration. - **124**: Internal sizing code (50mm x 50mm footprint). - **C2**: Material and Finish code (C2 usually indicates Aluminum with a Blue Anodized finish). - **R0**: Revision/Packaging code. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it has no electrical components), it plays a critical role in the electronic circuit's reliability: 1. **Thermal Conduction**: It draws heat away from the semiconductor die via the baseplate. 2. **Surface Area Expansion**: The "fins" increase the surface area exposed to the air, allowing for faster heat transfer via convection. 3. **Mounting Integrity**: The **pushPIN™** system ensures a consistent pressure (compression) against the electronic component, which is vital for the thermal interface material (TIM) to work effectively. --- ### 4. Implementation Example In a typical PCB design, this part is used as follows: ```yaml Component: High-Power FPGA or Processor Thermal Load: 15W - 30W Cooling Type: Active (with fan) or Passive (with high airflow) Assembly: - Apply Thermal Paste/Pad - Align Heat Sink over the chip - Insert Push-Pins into PCB holes (pre-drilled) - Springs engage to lock the heat sink in place ```