Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-16D-133-C2-R0

  • AI
    The **ATS-16D-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Heat Sink Type** | Push Pin | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Dimension (L x W x H)** | 70mm x 70mm x 10mm | | **Thermal Resistance (Flow)** | 2.10°C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 0.96°C/W | --- ## 2. Key Features The "C2" in the part number refers to the specific material and finish grade, while the "R0" indicates the revision or packaging style. ### A. Push Pin Attachment This part uses a specific mechanical attachment system: * **Compression Springs:** Provides precise pressure to ensure the heat sink remains in contact with the chip. * **Plastic/Brass Pins:** Designed to fit into pre-drilled holes in the Printed Circuit Board (PCB). ### B. Thermal Interface Material (TIM) * The unit typically comes pre-applied with **T766 thermal phase change material**. * This ensures high conductivity between the heat source and the aluminum fins without needing additional paste. ### C. Fin Design * **Cross-Cut Pattern:** The fins are designed to facilitate airflow from multiple directions, making it efficient for systems with non-linear airflow. * **Low Profile:** At only 10mm high, it is designed for space-constrained applications like 1U servers or thin embedded systems. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS-16** | Series ID (pushPIN™) | | **D** | Material/Attachment Class | | **133** | Dimension/Geometry Code | | **C2** | Blue Anodized Finish | | **R0** | Standard RoHS Compliant Revision | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin attachment of this heat sink?
    • ⤷ How does the thermal resistance change as the air velocity (LFM) increases for this model?
    • ⤷ Can this heat sink be used with a different thermal interface material if the pre-applied T766 is removed?