ATS-16D-133-C2-R0
AI

The **ATS-16D-133-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Heat Sink Type** | Push Pin |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic) |
| **Dimension (L x W x H)** | 70mm x 70mm x 10mm |
| **Thermal Resistance (Flow)** | 2.10°C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 0.96°C/W |
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## 2. Key Features
The "C2" in the part number refers to the specific material and finish grade, while the "R0" indicates the revision or packaging style.
### A. Push Pin Attachment
This part uses a specific mechanical attachment system:
* **Compression Springs:** Provides precise pressure to ensure the heat sink remains in contact with the chip.
* **Plastic/Brass Pins:** Designed to fit into pre-drilled holes in the Printed Circuit Board (PCB).
### B. Thermal Interface Material (TIM)
* The unit typically comes pre-applied with **T766 thermal phase change material**.
* This ensures high conductivity between the heat source and the aluminum fins without needing additional paste.
### C. Fin Design
* **Cross-Cut Pattern:** The fins are designed to facilitate airflow from multiple directions, making it efficient for systems with non-linear airflow.
* **Low Profile:** At only 10mm high, it is designed for space-constrained applications like 1U servers or thin embedded systems.
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## 3. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
| Segment | Meaning |
| :--- | :--- |
| **ATS-16** | Series ID (pushPIN™) |
| **D** | Material/Attachment Class |
| **133** | Dimension/Geometry Code |
| **C2** | Blue Anodized Finish |
| **R0** | Standard RoHS Compliant Revision |
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- ⤷
What are the PCB hole requirements for the push-pin attachment of this heat sink?
- ⤷ How does the thermal resistance change as the air velocity (LFM) increases for this model?
- ⤷ Can this heat sink be used with a different thermal interface material if the pre-applied T766 is removed?