The part number **ATS-16D-141-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this specific component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.76 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Attachment Method** | Push Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe the physical characteristics of the unit: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16D**: Refers to the specific series and mounting hole pattern. * **141**: Indicates the fin geometry and specific model dimensions. * **C2**: Refers to the material and finish (Blue Anodized Aluminum). * **R0**: Indicates the revision or specific packaging/kit version. --- ### 3. Key Electronic Functions While a heat sink is a passive mechanical part, its role in an electronic circuit is critical for longevity and performance: 1. **Thermal Management**: It increases the surface area of the heat-generating component, allowing for more efficient heat dissipation into the surrounding air via convection. 2. **Thermal Interface Material (TIM)**: The unit comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the chip and the heat sink to ensure maximum heat transfer. 3. **Mechanical Stability**: The use of brass push pins with a specific spring tension ensures a consistent pressure (mounting force) against the electronic chip, which prevents the heat sink from shifting during vibration or thermal expansion. --- ### 4. Typical Applications * **Embedded Systems**: Cooling small form-factor processors. * **Telecommunications**: Heat management for high-speed data chips. * **Power Supplies**: Dissipating heat from voltage regulators or MOSFETs.