ATS-16D-148-C2-R0
AI

The **ATS-16D-148-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm |
| **Fin Style** | XC-Cut (Cross-cut) |
| **Thermal Resistance** | 8.59°C/W (at 100 LFM) |
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## 2. Key Features and Component Design
### A. Fin Pattern: XC-Cut
The "XC-Cut" refers to the cross-cut fin geometry. Unlike straight fins, this design creates a grid of small pins or blocks.
* **Omnidirectional Airflow:** It allows air to enter the heat sink from any direction, making it ideal for enclosures where airflow patterns are unpredictable.
* **Surface Area:** Increases the total surface area for heat exchange without increasing the footprint.
### B. pushPIN™ Attachment System
The part uses a specialized mechanical attachment rather than adhesive tape:
1. **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB.
2. **Compression Springs:** These provide precise, uniform pressure (Force) across the thermal interface material (TIM).
3. **Reliability:** Mechanical mounting is superior to adhesives in high-vibration environments.
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates that this unit comes pre-applied with **T766 phase change material**. This ensures a low thermal resistance path between the chip and the aluminum base.
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## 3. Part Number Decoder (ATS-16D-148-C2-R0)
| Segment | Meaning |
| :--- | :--- |
| **ATS-16** | Series identifier (pushPIN™ Heat Sink) |
| **D** | Material/Attachment variation |
| **148** | Specific model/dimension code |
| **C2** | Thermal Interface Material type (T766) |
| **R0** | RoHS Compliant / Revision code |
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- ⤷
What are the PCB hole diameter requirements for the push-pin mounting of this heat sink?
- ⤷ How does the thermal resistance of this part change at higher airflow (e.g.
- ⤷ 500 LFM)?
- ⤷ Is there a version of this heat sink available with a taller fin height for better passive cooling?