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  • ATS-16D-148-C2-R0

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    The **ATS-16D-148-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | XC-Cut (Cross-cut) | | **Thermal Resistance** | 8.59°C/W (at 100 LFM) | --- ## 2. Key Features and Component Design ### A. Fin Pattern: XC-Cut The "XC-Cut" refers to the cross-cut fin geometry. Unlike straight fins, this design creates a grid of small pins or blocks. * **Omnidirectional Airflow:** It allows air to enter the heat sink from any direction, making it ideal for enclosures where airflow patterns are unpredictable. * **Surface Area:** Increases the total surface area for heat exchange without increasing the footprint. ### B. pushPIN™ Attachment System The part uses a specialized mechanical attachment rather than adhesive tape: 1. **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide precise, uniform pressure (Force) across the thermal interface material (TIM). 3. **Reliability:** Mechanical mounting is superior to adhesives in high-vibration environments. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **T766 phase change material**. This ensures a low thermal resistance path between the chip and the aluminum base. --- ## 3. Part Number Decoder (ATS-16D-148-C2-R0) | Segment | Meaning | | :--- | :--- | | **ATS-16** | Series identifier (pushPIN™ Heat Sink) | | **D** | Material/Attachment variation | | **148** | Specific model/dimension code | | **C2** | Thermal Interface Material type (T766) | | **R0** | RoHS Compliant / Revision code | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the push-pin mounting of this heat sink?
    • ⤷ How does the thermal resistance of this part change at higher airflow (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is there a version of this heat sink available with a taller fin height for better passive cooling?