ATS-16D-15-C2-R0
AI

The **ATS-16D-15-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components such as CPUs, GPUs, or high-power transistors.
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## 1. Technical Specifications
The part number encodes specific physical and thermal characteristics of the device:
| Parameter | Specification |
| :--- | :--- |
| **Product Type** | Heat Sink |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 7.44°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm |
| **Fin Style** | Straight (Square) |
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## 2. Key Electronic Features
### Thermal Performance
The primary purpose of this part is **heat dissipation**. It manages thermal energy to prevent semiconductor junction temperatures from exceeding safe limits.
* **Low Flow Optimization:** The fin design is optimized for environments with low-velocity airflow.
* **C2 Classification:** The "C2" suffix typically indicates a specific thermal interface material (TIM) or a specific coating/attachment configuration provided by ATS.
### Mechanical Attachment (pushPIN™)
Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system:
* It utilizes a brass or plastic pin with a compressed spring.
* This ensures a consistent, high-pressure contact between the heat sink and the electronic component, which minimizes thermal resistance.
### Material Science
* **Aluminum 6063:** Provides a balance of thermal conductivity and weight.
* **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and emissivity for radiant heat transfer.
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## 3. Applications
This part is commonly found in the following electronic sectors:
1. **Telecommunications:** Cooling of high-speed networking switches.
2. **Industrial PC:** Thermal management for embedded processors.
3. **Power Electronics:** Managing heat in DC-DC converters or motor drivers.
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- ⤷What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ Which hole pattern is required on the PCB to mount the pushPIN™ system?
- ⤷ Can this heat sink be used with a custom Thermal Interface Material (TIM)?