The **ATS-16D-150-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or high-power transistors. ### Technical Specifications Below are the primary electronic and mechanical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 4.82°C/W (at 100 LFM) | | **Base Dimensions** | 35mm x 35mm | | **Height** | 25mm | | **Fin Style** | Straight Fin | | **TIM (Interface Material)** | T766 (Pre-applied) | --- ### Core Components and Features #### 1. Push-Pin Mounting System Unlike adhesive-based heat sinks, the `-R0` suffix indicates a mechanical **push-pin** attachment. * **Electronic Safety:** This ensures a constant, uniform pressure on the electronic component, preventing "hot spots." * **Security:** It is more reliable in high-vibration environments compared to thermal tape. #### 2. Thermal Interface Material (TIM) The part comes pre-applied with **T766 thermal grease**. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip. * **Benefit:** This maximizes heat transfer efficiency immediately upon installation without needing manual application. #### 3. Fin Design (Straight Fin) The fins are designed for **longitudinal airflow**. This makes the part ideal for electronics housed in server racks or enclosures where fans provide a steady directional air stream. #### 4. Material (Aluminum 6063) * **Conductivity:** Offers high thermal conductivity to pull heat away from the silicon die. * **Finish:** The "Blue Anodized" coating provides a protective oxide layer that prevents corrosion and improves emissivity. --- ### Application Scenarios This specific part is typically found in: * **Networking Equipment:** Routers and switches with high-speed processing chips. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where passive cooling is supplemented by chassis airflow.