The **ATS-16D-151-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is part of the "pushPIN™" series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16D-151-C1-R0 | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height (H)** | 20.00 mm | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.90°C/W (at 100 LFM) | --- ### 2. Key Design Features The part is engineered for efficiency in cramped electronic environments (like servers or high-speed networking gear). * **Fin Pitch & Style:** It features a **Fine Pitch** design with a **Straight Fin** pattern. This is optimized for high-velocity airflow (ducted air) to maximize surface area contact. * **PushPIN™ Mounting:** Instead of messy adhesives or simple clips, it uses a specialized pin and spring mechanism. This provides: * **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for better heat transfer. * **Easy Installation:** Pre-drilled holes in the PCB allow for quick snap-in assembly. * **Material:** Made from high-grade aluminum for a balance of thermal conductivity and low weight. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal pad or grease (C1 designation often refers to the specific TIM type and blue anodized finish). --- ### 3. Thermal Performance (Airflow) Thermal resistance measures how effectively the part moves heat away from the component. Lower values are better. | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | 700 (3.5m/s) | | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (°C/W)** | 3.90 | 2.35 | 1.88 | 1.63 | --- ### 4. Typical Applications * **CPUs/GPUs:** Cooling microprocessors in embedded systems. * **ASICs:** Application-specific integrated circuits in telecommunications. * **Power Modules:** Managing heat in DC-DC converters or power supplies. ---