The **ATS-16D-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Thermal Resistance (Unducted)** | 3.32 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.11 °C/W @ 100 LFM | --- ## 2. Key Features and Components ### A. Material and Design - **Aluminum 6063:** This alloy provides a high strength-to-weight ratio and excellent thermal conductivity. - **Blue Anodized Finish:** This treatment increases surface emissivity and provides corrosion resistance. - **Cross-Cut/Pin Fin Design:** The "152" designation refers to a specific fin pattern that allows for multi-directional airflow, making it versatile for different PCB layouts. ### B. pushPIN™ Attachment System The "16D" and "C2" parts of the nomenclature refer to the mounting mechanism. It uses a **Push-Pin** system: - **Spring Loading:** Ensures a precise, consistent pressure (preload) between the heat sink and the electronic component. - **Ease of Assembly:** Can be installed manually or via automation, reducing the risk of damaging the PCB. ### C. Thermal Interface Material (TIM) The "R0" suffix indicates that this part typically comes pre-applied with **T766 thermal phase change material** or a high-performance thermal grease. This fills the microscopic air gaps between the component and the heat sink base to maximize heat transfer. --- ## 3. Applications This specific heat sink is commonly used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PC/Embedded Systems:** Compact boards where vertical space (25mm) is available. 3. **Power Electronics:** Voltage regulators and motor drivers. ---