The **ATS-16D-157-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions** | 40mm x 40mm | | **Height (Off Base)** | 25mm | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 3.35°C/W (at 100 LFM) | | **Fin Style** | XC-Cut (Cross-cut) | --- ### 2. Key Features and Components #### A. Attachment Mechanism (Push-Pin) This part utilizes a **push-pin and brass spring** assembly. * **Purpose:** It ensures a constant, high-pressure contact between the heat sink base and the electronic component. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### B. Thermal Interface Material (TIM) The "R0" suffix usually indicates the inclusion of a pre-applied thermal material. * **Phase Change Material:** It often comes with **T412** thermal tape or grease, ensuring efficient heat transfer from the chip to the aluminum fins. #### C. Fin Design (XC-Cut) The fins are arranged in a "cross-cut" pattern. * **Function:** This design increases surface area and allows for multi-directional airflow. Unlike straight-fin designs, XC-cut sinks perform well regardless of which direction the cooling fan is blowing. --- ### 3. Application Use Cases This specific heat sink is typically found in: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Networking switches and routers. * **Power Supplies:** Cooling voltage regulators and high-speed MOSFETs. --- ### 4. Thermal Performance Overview Thermal resistance determines how many degrees the component's temperature will rise for every watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.35 | | 300 (1.5 m/s) | 1.76 | | 500 (2.5 m/s) | 1.43 |