The **ATS-16D-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "blue ice" series and is designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16D-16-C2-R0 | | **Heat Sink Type** | Push-Pin (Push-Pin attachment) | | **Fin Type** | Flat Fin (Straight) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 18.08°C/W (Natural Convection) | --- ### 2. Physical Dimensions Precision in dimensions is critical for PCB layout planning: * **Length:** 54.00 mm * **Width:** 54.00 mm * **Height:** 10.00 mm (Low profile design) * **Pitch (Hole spacing):** 47.00 mm --- ### 3. Key Electronic Design Features * **Attachment Mechanism:** It uses a **Push-Pin** system with a compression spring. This ensures even pressure across the electronic component, improving thermal interface contact and preventing mechanical stress on the PCB. * **Material Properties:** Made of high-grade aluminum. The **Blue Anodized** finish is not just aesthetic; it increases emissivity and provides a layer of electrical insulation and corrosion resistance. * **High Performance:** Part of the *maxiFLOW™* line, it features a graduated fin design that increases surface area for maximum heat dissipation while maintaining low pressure drop. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-efficiency phase-change thermal pad. --- ### 4. Application Use Cases This part is commonly found in: 1. **Telecommunications:** Cooling of high-speed ASICs. 2. **Embedded Systems:** Industrial PCs where vertical space is limited (10mm height). 3. **Power Supplies:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).