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  • ATS-16D-161-C2-R0

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    The **ATS-16D-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its technical specifications and features. --- ### 1. General Specifications This part is designed for cooling electronic components such as CPUs, GPUs, or power modules on a Printed Circuit Board (PCB). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 4.74°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance from surrounding components. * **Length (A):** 45.00 mm * **Width (B):** 45.00 mm * **Height (C):** 20.00 mm (Low profile) * **Pitch (E/F):** 50.00 mm (Distance between attachment pins) --- ### 3. Key Electronic/Mechanical Features #### A. Fin Design (Cobra Pattern) The unit features a **straight fin** design. This allows for high-density surface area to dissipate heat while maintaining a low pressure drop, making it efficient for systems with a steady airflow. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or complex screws, this part uses a **spring-loaded push-pin** mechanism. * **Benefits:** Provides consistent pressure for optimal thermal interface material (TIM) performance. * **Hardware:** It typically uses brass or plastic pins with stainless steel springs. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface. * **T766:** This part comes pre-applied with a high-performance thermal grease to ensure maximum heat transfer from the component to the aluminum base. --- ### 4. Performance Data (Airflow) Thermal resistance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.74 | | 300 (1.5 m/s) | 2.57 | | 500 (2.5 m/s) | 2.02 | | 700 (3.5 m/s) | 1.75 | --- ### Summary of Part Number Suffixes * **-C2:** Indicates the use of T766 thermal grease. * **-R0:** Refers to the revision code and packaging/standard compliance.
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ How do I calculate the correct hole diameter on the PCB for the push-pins?
    • ⤷ Are there alternative fin patterns available for higher airflow environments?