ATS-16D-161-C2-R0
AI

The **ATS-16D-161-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by Advanced Thermal Solutions (ATS).
Below is a detailed breakdown of its technical specifications and features.
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### 1. General Specifications
This part is designed for cooling electronic components such as CPUs, GPUs, or power modules on a Printed Circuit Board (PCB).
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Thermal Resistance** | 4.74°C/W (Unducted Flow @ 100 LFM) |
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### 2. Physical Dimensions
The physical footprint is critical for PCB layout and clearance from surrounding components.
* **Length (A):** 45.00 mm
* **Width (B):** 45.00 mm
* **Height (C):** 20.00 mm (Low profile)
* **Pitch (E/F):** 50.00 mm (Distance between attachment pins)
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### 3. Key Electronic/Mechanical Features
#### A. Fin Design (Cobra Pattern)
The unit features a **straight fin** design. This allows for high-density surface area to dissipate heat while maintaining a low pressure drop, making it efficient for systems with a steady airflow.
#### B. pushPIN™ Attachment System
Instead of using messy thermal adhesives or complex screws, this part uses a **spring-loaded push-pin** mechanism.
* **Benefits:** Provides consistent pressure for optimal thermal interface material (TIM) performance.
* **Hardware:** It typically uses brass or plastic pins with stainless steel springs.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the type of thermal interface.
* **T766:** This part comes pre-applied with a high-performance thermal grease to ensure maximum heat transfer from the component to the aluminum base.
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### 4. Performance Data (Airflow)
Thermal resistance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 4.74 |
| 300 (1.5 m/s) | 2.57 |
| 500 (2.5 m/s) | 2.02 |
| 700 (3.5 m/s) | 1.75 |
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### Summary of Part Number Suffixes
* **-C2:** Indicates the use of T766 thermal grease.
* **-R0:** Refers to the revision code and packaging/standard compliance.
- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ How do I calculate the correct hole diameter on the PCB for the push-pins?
- ⤷ Are there alternative fin patterns available for higher airflow environments?