ATS-16D-162-C2-R0
AI

The **ATS-16D-162-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Fin Style** | Straight (High-density) |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 3.62 °C/W (@ 100 LFM) |
| **Compliance** | RoHS and REACH Compliant |
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### 2. Key Components & Design Features
#### A. Thermal Interface Material (TIM)
The part comes pre-applied with **T766**, a high-performance phase-change material. This ensures maximum heat transfer between the electronic component (the heat source) and the aluminum base of the heat sink by filling microscopic air gaps.
#### B. Attachment Mechanism (pushPIN™)
The "16D" in the part number indicates a specific attachment kit. It uses a spring-loaded push-pin system which provides:
* **Uniform Pressure:** Ensures consistent contact across the entire surface of the component.
* **Secure Mounting:** Prevents the heat sink from shifting due to vibration or shock.
#### C. Fin Geometry
The sink uses a **cross-cut** or high-density straight fin design. This maximizes surface area for air convection while maintaining a low profile, allowing it to fit in tighter enclosures without sacrificing cooling performance.
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### 3. Application Use Cases
This component is typically found in:
* **Networking Equipment:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Cooling for Voltage Regulator Modules (VRMs).
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- ⤷
What are the airflow requirements to achieve the optimal 3.62 °C/W thermal resistance?
- ⤷ Does this model support custom mounting hole patterns on a PCB?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?