The **ATS-16D-17-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic integrated circuits (ICs) and surface-mount components. --- ## 1. Technical Specifications The model number encodes the specific dimensions, material, and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 54mm x 54mm | | **Height** | 12.7mm (Low Profile) | | **Fin Type** | XC-Cut (Cross-Cut) | | **Thermal Resistance** | 15.44 °C/W (at 100 LFM) to 1.58 °C/W (at 700 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | --- ## 2. Key Electronic Functions ### Thermal Dissipation This part is a **passive cooler**. Its primary function is to increase the surface area of a heat-generating component (like a CPU, FPGA, or power transistor). By conducting heat from the semiconductor die to the aluminum fins, it allows air (either natural or forced) to carry the heat away, preventing thermal throttling or component failure. ### The "C2" Material Rating In the ATS naming convention, **C2** refers to the thermal interface material (TIM) or the specific aluminum alloy grade. In this case, it indicates that the heat sink comes pre-applied with a **T766 Phase Change Material** or high-performance thermal grease to ensure maximum heat transfer between the chip and the sink. ### Mechanical Attachment (pushPIN™) Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical push-pin system: * **Reliability:** Provides consistent pressure (clamping force) for better thermal contact. * **Reusability:** Can be removed for maintenance without damaging the PCB. * **Vibration Resistance:** Securely locks into 3.0mm holes on the PCB, making it suitable for industrial or automotive electronics. --- ## 3. Comparison of Thermal Performance | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.44 | | 300 (1.5 m/s) | 4.38 | | 500 (2.5 m/s) | 2.57 | | 700 (3.5 m/s) | 1.58 | --- ## 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processors. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators. * **Industrial Controls:** Ensuring stability in high-ambient temperature environments.