The part number **ATS-16D-170-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" thermal management line, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.44°C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height** | 15.00 mm | | **Fin Type** | Fine-Pitch (Straight Fins) | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Component Breakdown The part number follows a specific nomenclature used by ATS to identify the cooling capability and mounting hardware: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16D**: Refers to the specific series and mounting hole pattern. * **170**: Designates the internal design profile and fin configuration. * **C2**: Indicates the material/finish (Aluminum with Blue Anodized coating). * **R0**: Refers to the revision and packaging (Standard RoHS compliant). --- ### 3. Key Electronic Functions While a heatsink is a mechanical part, its role in an electronic circuit is critical for **Thermal Management**: 1. **Heat Dissipation:** It increases the surface area of a semiconductor package, allowing heat to transfer more efficiently into the surrounding air via convection. 2. **Thermal Interface Material (TIM):** This part comes with **T766** pre-applied. This is a specialized material that fills microscopic air gaps between the chip and the heatsink to maximize heat transfer. 3. **Mechanical Stability:** The **pushPIN™** system uses a brass pin and a stainless steel spring. This ensures constant pressure (clamping force) on the electronic component, which prevents the heatsink from shifting during vibration or thermal expansion. --- ### 4. Typical Applications * **Embedded Systems:** Cooling small form-factor processors. * **Telecommunications:** Managing heat in routers and switches. * **Power Supplies:** Cooling voltage regulators and power MOSFETs.