The **ATS-16D-172-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height (Fin Height)** | 25.00mm | | **Fin Style** | XC (Cross-Cut) / Straight Fin | | **Thermal Resistance** | 5.76°C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16**: Series or specific family identifier. * **D**: Material/Revision code. * **172**: Dimensional code (30x30x25mm). * **C2**: Thermal Interface Material (TIM) and Performance. "C2" typically denotes a **T766** high-performance phase-change material or specific thermal grease. * **R0**: RoHS compliance status. --- ### 3. Key Electronic Cooling Features #### Push-Pin Mounting This part uses a push-pin mounting system. In electronic PCB design, this means the board must have pre-drilled holes. The spring-loaded pins provide: * **Constant Pressure:** Ensures the heat sink stays in contact with the component. * **Vibration Resistance:** Secure enough for mobile or industrial applications. #### Cross-Cut (XC) Fin Design The "XC" design features fins that are cut both horizontally and vertically. This is superior to standard straight fins because: 1. It increases surface area for heat dissipation. 2. It allows for **omnidirectional airflow**, meaning it works efficiently regardless of which direction the cooling fan is blowing. #### Thermal Interface Material (TIM) The "C2" designation implies that the heat sink comes with a **pre-applied TIM**. This reduces assembly time in manufacturing and ensures there are no air gaps between the electronic chip and the aluminum base. --- ### 4. Applications This specific size and thermal resistance are commonly found in: * **Telecommunications:** Cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Managing heat in MOSFETs or voltage regulators.