The **ATS-16D-175-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic characteristics. --- ### 1. General Specifications This part belongs to the **pushPIN™** series, designed for secure and efficient attachment to Integrated Circuits (ICs) and other electronic components. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-16D-175-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.35°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision in dimensions is critical for ensuring the heat sink fits within the allocated PCB real estate. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height:** 10.00 mm (Low profile) * **Pitch (Fin Spacing):** Fine Pitch * **Pattern:** Cross-cut (Multiple square fins for omnidirectional airflow) --- ### 3. Thermal Performance The efficiency of a heat sink is measured by its ability to dissipate heat based on the velocity of airflow (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 13.52 | | 200 (1.0 m/s) | 4.90 | | 300 (1.5 m/s) | 3.51 | | 400 (2.0 m/s) | 2.85 | | 500 (2.5 m/s) | 2.48 | --- ### 4. Mounting and Interface The "R0" suffix indicates specific material and compliance standards: * **Attachment:** Uses a brass pushpin with a stainless steel spring to provide consistent pressure. * **Thermal Interface Material (TIM):** Pre-applied **T766** (a high-performance thermal grease) to ensure maximum heat transfer between the chip and the aluminum. * **Compliance:** RoHS and REACH compliant (Lead-free). ### 5. Application Use-Case This specific model is ideal for: * **Low-profile enclosures:** Where vertical space is limited (only 10mm high). * **High-density PCBs:** The 35x35mm footprint fits common BGA (Ball Grid Array) packages. * **Active cooling environments:** Best used in systems with internal fans. ---