The **ATS-16D-189-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic properties. --- ### 1. General Specifications This part is manufactured by **Advanced Thermal Solutions Inc.** and belongs to the **blueICE™** or **pushPIN™** series. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16D-189-C2-R0 | | **Category** | Thermal Management - Heatsinks | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.43°C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision measurements are critical for ensuring the heatsink fits on a Printed Circuit Board (PCB) without interfering with adjacent components. * **Length (A):** 45.00 mm * **Width (B):** 45.00 mm * **Height (C):** 20.00 mm * **Pitch (E/F):** 50.00 mm (Distance between mounting holes) --- ### 3. Thermal Performance Data The effectiveness of a heatsink is measured by its ability to dissipate heat based on airflow (measured in Linear Feet per Minute - LFM). | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 2.43 °C/W | | **200 LFM (1.0 m/s)** | 1.44 °C/W | | **300 LFM (1.5 m/s)** | 1.15 °C/W | | **400 LFM (2.0 m/s)** | 1.00 °C/W | --- ### 4. Electronic & Mechanical Features * **Attachment Mechanism:** It uses a **pushPIN™** system which ensures a secure fit and constant pressure on the processor/chip. This maximizes the efficiency of the Thermal Interface Material (TIM). * **Material Composition:** The **Aluminum** construction provides a balance between lightweight design and high thermal conductivity. The **Blue Anodized** coating prevents oxidation and improves emissivity. * **Fin Design:** It typically features a **Cross-Cut** or **Straight Fin** pattern designed to allow airflow from multiple directions, making it versatile for different fan layouts. * **RoHS Compliant:** The "R0" suffix indicates that the part is compliant with environmental regulations regarding hazardous substances. --- ### 5. Application Example This heatsink is commonly used for: 1. **CPUs/GPUs** in embedded systems. 2. **FPGAs** (Field Programmable Gate Arrays) that generate significant heat during high-speed processing. 3. **Power Supplies** where high-voltage regulators require surface cooling. ---