The **ATS-16D-191-C2-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic surface-mount devices. --- ### 1. Technical Specifications The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.90°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Pattern** | Straight Fin | --- ### 2. Physical Design and Construction #### **The Heat Sink Body** * **Material:** Made from AL6063 aluminum, which offers a balance of high thermal conductivity and structural integrity. * **Fin Style:** It features a **Straight Fin** design. This is optimized for "forced air" cooling (where a fan is present). Straight fins provide low resistance to airflow, allowing heat to be carried away efficiently. * **Surface Treatment:** The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving radiant heat transfer. #### **The Attachment Mechanism (pushPIN™)** The "R0" suffix indicates the use of the ATS pushPIN™ system, which includes: * **Brass Components:** A brass pin that goes through pre-drilled holes in the PCB. * **Stainless Steel Spring:** Provides consistent "Point of Contact" pressure between the heat sink and the chip, ensuring maximum thermal transfer. * **Plastic Attachment:** Often includes a polyimide or plastic grommet to prevent damage to the motherboard. --- ### 3. Thermal Performance Profile The effectiveness of this part depends on the velocity of the air moving through it (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 2.90 | | 300 | 1.5 | 1.48 | | 500 | 2.5 | 1.18 | | 700 | 3.5 | 1.02 | --- ### 4. Typical Applications This specific size (45mm) and height (30mm) is commonly used for: 1. **Processors:** High-speed CPUs or GPUs in embedded systems. 2. **FPGA/ASIC:** Large-scale programmable logic devices that generate significant heat. 3. **Power Supplies:** Large transistors or MOSFET arrays in industrial power converters.