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  • ATS-16D-192-C2-R0

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    The **ATS-16D-192-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 2.35°C/W (at 200 LFM) | --- ### 2. Physical Design Features This component utilizes a specialized fin geometry to maximize surface area and airflow efficiency. * **Fin Style:** Straight fin / Cross-cut pattern. This allows for multi-directional airflow, making it versatile for different system layouts. * **Thermal Interface Material (TIM):** Pre-applied **T766** (a high-conductivity phase-change material or grease) on the base to ensure optimal heat transfer between the component and the sink. * **Mechanical Connection:** It uses the **pushPIN™** system, which features a built-in spring mechanism. This ensures a precise, consistent pressure (preload) on the electronic chip to prevent damage while maintaining high thermal contact. --- ### 3. Thermal Performance Overview Thermal resistance indicates how effectively the part moves heat away from the silicon. Lower values represent better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 4.39 | | 200 (Unducted) | 2.35 | | 400 (Unducted) | 1.63 | | 600 (Unducted) | 1.34 | --- ### 4. Integration Code Example While this is a mechanical part, engineers often define these components in Bill of Materials (BOM) scripts or CAD automation. ```yaml # Example Metadata for PCB Design Software component: part_number: "ATS-16D-192-C2-R0" type: "Heat Sink" attachment: "Push-Pin" spring_type: "ATS-HK91-R0" footprint: length: 45mm width: 45mm height: 30mm material_safety: "RoHS Compliant" ``` ---
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1
    • ⤷ C2
    • ⤷ and C3 variants of this heat sink?
    • ⤷ How do I calculate the required LFM (Linear Feet per Minute) for my specific chip?
    • ⤷ What is the recommended hole pattern on the PCB for the push-pin attachment?