ATS-16D-192-C2-R0
AI

The **ATS-16D-192-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Detail |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Dimensions** | 45mm x 45mm x 30mm |
| **Thermal Resistance** | 2.35°C/W (at 200 LFM) |
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### 2. Physical Design Features
This component utilizes a specialized fin geometry to maximize surface area and airflow efficiency.
* **Fin Style:** Straight fin / Cross-cut pattern. This allows for multi-directional airflow, making it versatile for different system layouts.
* **Thermal Interface Material (TIM):** Pre-applied **T766** (a high-conductivity phase-change material or grease) on the base to ensure optimal heat transfer between the component and the sink.
* **Mechanical Connection:** It uses the **pushPIN™** system, which features a built-in spring mechanism. This ensures a precise, consistent pressure (preload) on the electronic chip to prevent damage while maintaining high thermal contact.
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### 3. Thermal Performance Overview
Thermal resistance indicates how effectively the part moves heat away from the silicon. Lower values represent better cooling.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Unducted) | 4.39 |
| 200 (Unducted) | 2.35 |
| 400 (Unducted) | 1.63 |
| 600 (Unducted) | 1.34 |
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### 4. Integration Code Example
While this is a mechanical part, engineers often define these components in Bill of Materials (BOM) scripts or CAD automation.
```yaml
# Example Metadata for PCB Design Software
component:
part_number: "ATS-16D-192-C2-R0"
type: "Heat Sink"
attachment: "Push-Pin"
spring_type: "ATS-HK91-R0"
footprint:
length: 45mm
width: 45mm
height: 30mm
material_safety: "RoHS Compliant"
```
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- ⤷What is the difference between the C1
- ⤷ C2
- ⤷ and C3 variants of this heat sink?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for my specific chip?
- ⤷ What is the recommended hole pattern on the PCB for the push-pin attachment?