The **ATS-16D-26-C2-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to their "Blue Anodized" family of thermal management components. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | Description | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | Thermal management specialist | | **Material** | Aluminum | High thermal conductivity | | **Finish** | Blue Anodized | Corrosion resistance and aesthetic | | **Attachment Method** | pushPIN™ | Spring-loaded mounting for secure pressure | | **Thermal Resistance** | 14.20° C/W (@ 100 LFM) | Rate at which heat dissipates | | **Dimensions** | 70mm x 70mm x 10mm | Large surface area, low profile | --- ## 2. Component Breakdown ### A. The Heat Sink Body The core component is an aluminum plate with a high-density fin pattern. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The **C2** in the part number indicates the finish (Blue Anodized), which increases the surface emissivity, slightly improving radiative heat transfer. ### B. Mounting System (pushPIN™) Unlike simple adhesive heat sinks, this part uses the **pushPIN™** system: * **Springs:** Pre-assembled with a specific compression force to ensure consistent contact between the sink and the component (CPU, GPU, or FPGA). * **Plastic/Brass Push Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) The **R0** suffix typically denotes the inclusion of a pre-applied thermal interface material (like a phase-change material or high-performance pad) on the base of the heat sink. This eliminates the need for manual application of thermal paste and ensures air gaps are minimized. --- ## 3. Application & Use Cases This specific model is designed for high-power electronics that generate significant heat but have limited vertical clearance. * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** For industrial computers requiring passive or active airflow cooling. --- ## 4. Part Number Decoder | Segment | Meaning | | :--- | :--- | | **ATS-16** | Series ID (Advanced Thermal Solutions Series 16) | | **D** | Material/Attachment type | | **26** | Specific geometry/fin configuration | | **C2** | Color/Finish (Blue Anodized) | | **R0** | Package/TIM variation |