The **ATS-16D-28-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance (Flow)** | 10.57°C/W @ 100 LFM | | **Thermal Resistance (Unducted)** | 1.88°C/W @ 500 LFM | --- ### 2. Key Design Components #### A. Fin Pattern (Cross-Cut) The ATS-16D-28-C2-R0 utilizes a **cross-cut fin design**. Unlike straight fins, cross-cutting creates a grid of small pins or square blocks. This increases the surface area and promotes turbulence in the airflow, which significantly improves heat dissipation efficiency in restricted spaces. #### B. Attachment Mechanism (pushPIN™) The part features a specialized mounting system: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide consistent pressure (Force) between the heat sink and the component, ensuring an airtight thermal interface. #### C. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heat sink comes pre-applied with a **Phase Change Material (PCM)** or high-performance thermal grease. This eliminates the need for manual application and ensures low thermal resistance between the chip and the aluminum base. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS-16D** | Series and ID | | **28** | Specific Fin/Pattern Configuration | | **C2** | Thermal Interface Material (T766 or similar high-performance grease) | | **R0** | RoHS-6 Compliant / Revision code | ### 4. Application Use Cases This heat sink is commonly used in: * **Networking Gear:** Cooling ASICs in routers and switches. * **Power Supplies:** Managing heat for MOSFETs or power regulators. * **Embedded Systems:** Industrial PCs where vertical clearance is limited (15mm height). ---