The **ATS-16D-35-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. --- ## 1. Technical Specifications This part belongs to the **pushPIN™** series, designed for easy mounting and high thermal efficiency on Printed Circuit Boards (PCBs). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16D-35-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight (Fine Pitch) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 22.58°C/W (Unducted Flow @ 100 LFM) | --- ## 2. Key Electronic Components & Features ### A. Material & Thermal Conductivity The heat sink is made from **AL6063 aluminum**, which offers an excellent balance between thermal conductivity, weight, and corrosion resistance. The **Blue Anodized** finish is not just aesthetic; it increases surface emissivity, improving heat radiation and protecting the metal from oxidation. ### B. The pushPIN™ Attachment System This component uses a specialized mounting system rather than simple adhesive: * **Brass Push Pins:** Provides secure attachment to the PCB holes. * **Compression Springs:** These ensure a precise and consistent **Pressure** (Pre-assembled) against the electronic component (CPU, FPGA, or MOSFET), which is critical for maximizing heat transfer through the Thermal Interface Material (TIM). ### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the part comes with **T412** thermal tape or grease pre-applied to the base. This fills microscopic air gaps between the electronic chip and the heat sink base to lower thermal resistance. --- ## 3. Performance Data (Airflow) Thermal performance varies based on the Linear Feet per Minute (LFM) of airflow within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.58 | | 300 (1.5 m/s) | 13.04 | | 500 (2.5 m/s) | 9.10 | | 700 (3.5 m/s) | 7.16 | --- ## 4. Typical Applications This specific size (35mm) and low profile (10mm) are commonly used for: 1. **Network Switches/Routers:** Cooling small processors. 2. **Power Supplies:** Heat dissipation for voltage regulators. 3. **Embedded Systems:** Industrial PCs where vertical space is limited.