The **ATS-16D-40-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 14.74 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 15.00 mm | | **Pitch** | Fine Pitch | --- ### 2. Design and Components The "electronic parts" of this assembly include the physical structure and the mounting hardware: * **Heat Sink Body:** A square aluminum block with a "Fine-Pitch" fin pattern. This maximize surface area for heat exchange with the surrounding air. * **pushPIN™ Fasteners:** These are plastic or metal pins used to secure the heat sink to the PCB. They allow for quick installation and consistent pressure. * **Compression Springs:** Built into the pushPINs, these provide the required downward force (clamping pressure) to ensure a solid interface between the sink and the heat source. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal pad or grease on the base to fill microscopic air gaps. --- ### 3. Applications This part is commonly used to cool the following electronic components: 1. **CPUs and Microprocessors:** Found in embedded systems. 2. **FPGAs (Field Programmable Gate Arrays):** Which generate significant heat during high-speed logic operations. 3. **ASICs:** Application-specific integrated circuits in networking hardware. 4. **GPU/Video Controllers:** In industrial imaging or display systems. --- ### 4. Thermal Performance Overview Performance is measured by how effectively the device lowers the temperature of the silicon die per watt of power consumed. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.74 | 5.42 | 3.12 | 2.27 | 1.85 | *Note: As airflow increases (measured in Linear Feet per Minute), the efficiency of the heat sink improves drastically.* ---