The part number **ATS-16D-41-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically part of the "pushPIN™" thermal management series designed for cooling electronic components like CPUs, GPUs, and high-power ICs. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (with compression springs) | | **Fin Style** | Straight (Square-cut) | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 10.07 °C/W (Unducted @ 1.0 m/s) | | **Compatibility** | 45mm x 45mm PCB hole patterns | --- ### 2. Design and Component Breakdown #### A. The Heatsink Body The main body is constructed from **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Straight" fin design is optimized for high-performance airflow systems, allowing air to pass through the fins and carry away heat via convection. #### B. The pushPIN™ Mechanism Unlike adhesive-based cooling, this part uses a mechanical attachment system: * **Push-Pins:** Plastic or brass pins that lock into the PCB holes. * **Springs:** Stainless steel compression springs that provide consistent downward pressure on the electronic chip, ensuring a tight seal with the thermal interface material. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates the type of thermal interface. This model usually comes with **T766 Phase Change Material**, which melts during operation to fill microscopic air gaps between the chip and the heatsink, significantly reducing thermal resistance. --- ### 3. Part Number Decoder Understanding the nomenclature helps identify the exact electronic application: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16D**: Internal series designation. * **41**: Length/Width (approximate base size). * **C3**: Thermal Interface Material (TIM) code. * **R0**: RoHS compliance and revision status. --- ### 4. Key Applications * **Embedded Systems:** Cooling industrial microprocessors. * **Networking Hardware:** Heat dissipation for switches and routers. * **Power Electronics:** Managing heat for MOSFETs or high-speed voltage regulators.