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  • ATS-16D-50-C2-R0

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    The **ATS-16D-50-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Component Overview This part is part of the **pushPIN™** Heat Sink Assembly line. It is designed to be mounted on Integrated Circuits (ICs), CPUs, or GPUs to dissipate heat efficiently through convection. ### Technical Specifications | Feature | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Fin Type** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | 1.90°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin | | **Finish** | Blue Anodized | --- ## 2. Mechanical Dimensions Understanding the physical footprint is critical for PCB layout and clearance. * **Length:** 30.00 mm * **Width:** 30.00 mm * **Height:** 15.00 mm * **Hole Spacing:** 35.00 mm (between centers) --- ## 3. Key Electronic/Thermal Features ### Thermal Performance The efficiency of this heat sink varies based on the airflow (LFM - Linear Feet per Minute). As airflow increases, the thermal resistance decreases: * **@100 LFM (0.5 m/s):** 1.90°C/W * **@400 LFM (2.0 m/s):** 1.09°C/W * **@700 LFM (3.5 m/s):** 0.88°C/W ### Mounting Hardware (Push-Pin) The "R0" suffix indicates the hardware kit included. * **Pin Material:** Brass or Plastic (Standard ATS push-pin) * **Spring Type:** Stainless steel compression spring to ensure even pressure across the component surface. * **TIM (Thermal Interface Material):** Usually comes pre-applied with **T766** high-performance thermal grease. --- ## 4. Part Number Breakdown The part number follows a specific nomenclature: * **ATS:** Advanced Thermal Solutions * **16:** Design variant / Family * **D:** Pin material/style * **50:** Specific fin configuration * **C2:** Blue Anodized finish * **R0:** Revision/Packaging code ---
    ✨ Follow-up Questions
    • ⤷ What are the equivalent heat sinks with a higher profile (height) for better cooling?
    • ⤷ How do I calculate the required airflow for this specific heat sink?
    • ⤷ Is this heat sink compatible with standard BGA or LGA footprints?