ATS-16D-52-C3-R0
AI

The **ATS-16D-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors.
---
## Technical Specifications
The table below outlines the core physical and thermal properties of this specific part number:
| Specification | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ / blueICE™ |
| **Material** | Aluminum (AL6063) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Thermal Resistance (Unducted)** | 10.79 °C/W @ 100 LFM |
| **Finish** | Blue Anodized |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
## Breakdown of Part Number Components
The alphanumeric code `ATS-16D-52-C3-R0` is an intelligent part number that describes the unit's features:
1. **ATS**: Denotes the manufacturer (Advanced Thermal Solutions).
2. **16D**: Refers to the specific design family or series.
3. **52**: The unique design identifier for this specific fin pattern and size.
4. **C3**: Indicates the Thermal Interface Material (TIM) and specific hardware configuration.
5. **R0**: Refers to the revision and packaging status (RoHS compliance).
---
## Key Design Features
### 1. Fin Configuration
The heat sink features a **straight fin** design. This is optimized for airflow directed through the fins, allowing for maximum surface area contact with the air.
### 2. Push-Pin Attachment
Instead of using messy thermal epoxy or complex screws, this part uses a **Push-Pin** system.
* **Benefits**: Ensures consistent pressure on the component (improving heat transfer) and allows for easy installation/removal.
* **Compression Spring**: Works with the push-pin to maintain a precise "load" on the chip to prevent damage while ensuring thermal contact.
### 3. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance.
### 4. Anodized Finish
The **Blue Anodized** coating is not just for aesthetics; it provides:
* Increased corrosion resistance.
* Improved surface emissivity (radiant heat loss).
* Electrical insulation to prevent short circuits if the sink accidentally touches other components.
---
- ⤷
What are the airflow requirements to achieve the optimal 10.79 °C/W thermal resistance?
- ⤷ How does the Push-Pin attachment compare to adhesive-based mounting for this part?
- ⤷ Is this heat sink compatible with standard BGA or LGA component footprints?