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  • ATS-16D-52-C3-R0

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    The **ATS-16D-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ## Technical Specifications The table below outlines the core physical and thermal properties of this specific part number: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ / blueICE™ | | **Material** | Aluminum (AL6063) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Unducted)** | 10.79 °C/W @ 100 LFM | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## Breakdown of Part Number Components The alphanumeric code `ATS-16D-52-C3-R0` is an intelligent part number that describes the unit's features: 1. **ATS**: Denotes the manufacturer (Advanced Thermal Solutions). 2. **16D**: Refers to the specific design family or series. 3. **52**: The unique design identifier for this specific fin pattern and size. 4. **C3**: Indicates the Thermal Interface Material (TIM) and specific hardware configuration. 5. **R0**: Refers to the revision and packaging status (RoHS compliance). --- ## Key Design Features ### 1. Fin Configuration The heat sink features a **straight fin** design. This is optimized for airflow directed through the fins, allowing for maximum surface area contact with the air. ### 2. Push-Pin Attachment Instead of using messy thermal epoxy or complex screws, this part uses a **Push-Pin** system. * **Benefits**: Ensures consistent pressure on the component (improving heat transfer) and allows for easy installation/removal. * **Compression Spring**: Works with the push-pin to maintain a precise "load" on the chip to prevent damage while ensuring thermal contact. ### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. ### 4. Anodized Finish The **Blue Anodized** coating is not just for aesthetics; it provides: * Increased corrosion resistance. * Improved surface emissivity (radiant heat loss). * Electrical insulation to prevent short circuits if the sink accidentally touches other components. ---
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the optimal 10.79 °C/W thermal resistance?
    • ⤷ How does the Push-Pin attachment compare to adhesive-based mounting for this part?
    • ⤷ Is this heat sink compatible with standard BGA or LGA component footprints?