The **ATS-16D-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | |:---|:---| | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 36.83mm x 46.50mm x 10.00mm | | **Thermal Resistance** | 4.84°C/W (at 200 LFM) | | **Fin Style** | T-Cut (High aspect ratio) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Management (The Heat Sink) * **High Efficiency:** The maxiFLOW™ design features a spread fin structure which increases surface area while minimizing pressure drop. This allows for superior cooling in high-airflow environments. * **Low Profile:** With a height of only **10.00mm**, this part is ideal for height-constrained electronic assemblies such as 1U servers or thin embedded systems. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, the **ATS-16D-55-C2-R0** utilizes a pushPIN™ system: * **Mechanical Stability:** It uses a brass or plastic pin and a high-performance compression spring. * **Consistent Pressure:** This ensures the thermal interface material (TIM) is compressed evenly against the electronic chip, optimizing heat transfer. * **Pre-Assembled:** The pins are pre-assembled to the heat sink to reduce assembly time on the production line. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal material used. Usually, this refers to a high-performance **T766 phase change material** or a high-conductivity thermal grease pre-applied to the base of the heat sink to fill microscopic air gaps between the component and the sink. --- ### 3. Typical Applications * **Field Programmable Gate Arrays (FPGAs)** * **Application Specific Integrated Circuits (ASICs)** * **Network Switches and Routers** * **Power Supplies** ---