The **ATS-16D-56-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The part number encodes specific physical and thermal properties. Here is a breakdown of its core specifications: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Dimensions** | 37.00 x 37.00 x 12.70 mm | | **Fin Style** | XC-Cut (Cross-cut) | | **Thermal Resistance** | 17.72 °C/W (at 1.0 m/s airflow) | | **Weight** | ~45 grams | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Design The heat sink utilizes a spread-fin geometry. Unlike standard straight-fin heat sinks, the fins on the ATS-16D-56-C2-R0 are angled outward. This design maximizes the surface area for heat dissipation while minimizing pressure drop, which is critical for densely packed electronic enclosures. ### B. pushPIN™ Attachment This model uses the proprietary **pushPIN™** system. For electronic engineers, this means: * **Uniform Pressure:** The spring-loaded mechanism ensures consistent contact between the heat sink and the chip (e.g., FPGA, CPU, or GPU). * **Installation:** It requires pre-drilled holes in the PCB. It is faster and more reliable than adhesive-based thermal interface materials. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412 thermal tape** or a similar high-performance phase-change material. This ensures that the microscopic air gaps between the component and the heat sink are filled, reducing thermal resistance. --- ## 3. Comparison of Airflow Performance Thermal resistance varies based on the velocity of the air moving through the system (measured in LFM - Linear Feet per Minute): | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (Low flow) | 17.72 | | 2.0 (Medium flow) | 8.32 | | 3.0 (High flow) | 5.69 | --- ## 4. Typical Applications * **Network Equipment:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high. * **Telecom:** Base station electronics requiring long-term reliability.