The **ATS-16D-57-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic systems. --- ### ## Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Top Mount (Cross-Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 13.16°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### ## Key Electronic & Mechanical Components The "Electronic Part" designation for this component refers to its role in the **Physical Layer** of hardware design. Below are the functional details: #### 1. Heat Sink Geometry (Cross-Cut) The fins are designed in a cross-cut pattern. This allows for multi-directional airflow, making it ideal for systems where the air direction might change or where space is constrained. #### 2. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a **Brass Push-Pin** system with a compression spring. * **Benefits:** Ensures even pressure across the semiconductor (CPU/GPU/FPGA), improving heat transfer. * **Hole Pattern:** Designed for specific PCB layouts (standard 2-hole mounting). #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. * **Function:** Fills microscopic air gaps between the heat sink and the electronic chip. * **Advantage:** Reduces contact resistance, allowing heat to flow more efficiently from the silicon to the aluminum fins. #### 4. Blue Anodized Finish The surface treatment is not just for aesthetics. Anodizing increases the surface emissivity and provides a layer of electrical insulation and corrosion resistance, protecting the surrounding circuitry. --- ### ## Applications This specific model is typically used for cooling: * **FPGAs & ASICs** in networking equipment. * **Power Modules** in industrial power supplies. * **Embedded Processors** on motherboards.