The **ATS-16D-58-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic integrated circuits (ICs). --- ## 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Heat Sink Type** | Fine Pitch (Cross-Cut) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (Height Off Base)** | 25.00 mm | | **Pitch (Mounting Holes)** | 45.00 mm | | **Thermal Resistance** | 10.11°C/W (at 100 LFM) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "R0" suffix indicates a **push-pin assembly**. This provides: * **Constant Pressure:** The springs ensure uniform contact between the heat sink and the component, improving thermal transfer. * **Reliability:** It is more resistant to shock and vibration compared to thermal tape. * **Reusability:** The pins can be compressed and removed, allowing for easier maintenance or component replacement. ### B. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing provides corrosion resistance and increases surface emissivity, slightly enhancing radiative cooling. ### C. Fin Geometry The "58" in the part number refers to a specific fin pattern. This model uses a **cross-cut design**, which creates a matrix of small square pillars. This is ideal for: * **Omnidirectional Airflow:** It works efficiently regardless of which direction the fan is blowing. * **High Surface Area:** The fine pitch maximizes the area available for heat dissipation in a compact 40mm footprint. --- ## 3. Thermal Performance (Airflow Data) Thermal resistance measures how effectively the part moves heat away from the chip. Lower values are better. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 10.11 | 3.48 | 2.09 | 1.58 | 1.33 | | **Ducted Flow (°C/W)** | 1.92 | 1.27 | 1.05 | 0.93 | 0.84 | --- ## 4. Application Use Cases This part is typically found in: 1. **Networking Hardware:** Switches, routers, and gateways. 2. **Embedded Systems:** Industrial PCs and Single Board Computers (SBCs). 3. **Power Electronics:** Cooling MOSFETs or small voltage regulators.