ATS-16D-59-C2-R0
AI

The **ATS-16D-59-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure attachment to Printed Circuit Boards (PCBs).
### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | blueICE™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm |
| **Height** | 20mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Thermal Resistance** | 7.94°C/W (at 100 LFM) |
| **Spring Type** | Compression Spring |
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### 2. Design Characteristics
The part is engineered for optimized airflow and heat dissipation in confined electronic environments:
* **Fins:** It features a high-performance cross-cut fin pattern that provides a large surface area for heat exchange.
* **Push-Pin Attachment:** The use of brass push-pins and steel springs ensures consistent pressure (clamping force) against the heat-generating component, which improves thermal interface performance.
* **Thermal Interface Material (TIM):** Typically, these come pre-applied with **T766** (a high-performance thermal phase-change material) to ensure efficient heat transfer from the chip to the aluminum.
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### 3. Application Use Cases
The ATS-16D-59-C2-R0 is commonly used to cool integrated circuits (ICs) that generate significant heat during operation, such as:
1. **Processors (CPUs/GPUs):** Small to medium-sized embedded processors.
2. **ASICs and FPGAs:** Used in networking gear or industrial controllers.
3. **Power Electronics:** Voltage regulators or high-speed memory modules.
---
### 4. Thermal Performance Data
Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow Velocity | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 LFM (0.5 m/s)** | 7.94 |
| **300 LFM (1.5 m/s)** | 3.16 |
| **500 LFM (2.5 m/s)** | 2.27 |
- ⤷
How does the blue anodized finish affect the thermal performance compared to raw aluminum?
- ⤷ What is the recommended hole size on the PCB for the push-pin mounting?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?