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  • ATS-16D-59-C2-R0

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    The **ATS-16D-59-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | blueICE™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm | | **Height** | 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 7.94°C/W (at 100 LFM) | | **Spring Type** | Compression Spring | --- ### 2. Design Characteristics The part is engineered for optimized airflow and heat dissipation in confined electronic environments: * **Fins:** It features a high-performance cross-cut fin pattern that provides a large surface area for heat exchange. * **Push-Pin Attachment:** The use of brass push-pins and steel springs ensures consistent pressure (clamping force) against the heat-generating component, which improves thermal interface performance. * **Thermal Interface Material (TIM):** Typically, these come pre-applied with **T766** (a high-performance thermal phase-change material) to ensure efficient heat transfer from the chip to the aluminum. --- ### 3. Application Use Cases The ATS-16D-59-C2-R0 is commonly used to cool integrated circuits (ICs) that generate significant heat during operation, such as: 1. **Processors (CPUs/GPUs):** Small to medium-sized embedded processors. 2. **ASICs and FPGAs:** Used in networking gear or industrial controllers. 3. **Power Electronics:** Voltage regulators or high-speed memory modules. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 7.94 | | **300 LFM (1.5 m/s)** | 3.16 | | **500 LFM (2.5 m/s)** | 2.27 |
    ✨ Follow-up Questions
    • ⤷ How does the blue anodized finish affect the thermal performance compared to raw aluminum?
    • ⤷ What is the recommended hole size on the PCB for the push-pin mounting?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?