The **ATS-16D-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other PCB components. ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 2.85 °C/W (at 100 LFM) | | **Pressure Repair** | 0.82 (at 700 LFM) | --- ### 2. Key Components & Construction #### A. The Heat Sink Body The body is constructed from high-grade aluminum. It uses a **Straight Fin** design, which is optimized for "cross-cut" or unidirectional airflow. This allows for low pressure drop while maximizing the surface area available for heat dissipation. #### B. Attachment Mechanism: pushPIN™ Instead of using messy adhesives or permanent solder, this part uses the ATS pushPIN™ system: * **Springs:** Pre-assembled brass or steel springs provide consistent pressure (Normal Force) across the component. * **Plastic/Brass Pins:** These secure the heat sink to pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface. Typically, these units come with a pre-applied **T766 phase-change material** or high-performance thermal pad, ensuring that there are no microscopic air gaps between the heat source and the aluminum base. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific electronic properties: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **16D** | Series/Product Line (pushPIN™) | | **63** | Specific Die/Fin Pattern Profile | | **C2** | Thermal Interface Material (T766 / Blue Anodized) | | **R0** | Revision code | --- ### 4. Application Use-Cases This component is commonly used in electronic environments where space is moderate but heat generation is high, such as: * **Network Switches/Routers:** Cooling ASICs and FPGAs. * **Power Supplies:** Managing heat on MOSFETs. * **Industrial PCs:** Cooling embedded processors.