The **ATS-16D-66-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Anodized" push-pin series designed for cooling processors and other high-heat surface-mount components. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Part Number** | ATS-16D-66-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Style** | Straight (High-Flow Design) | | **Thermal Resistance** | 11.96°C/W (Natural Convection) | --- ## Dimensions and Physical Design The physical footprint of this heat sink is critical for PCB layout planning. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 25.00 mm * **Pitch (Hole spacing):** 38.00 mm ### Material Properties * **Aluminum Construction:** Offers a balance of lightweight design and high thermal conductivity. * **Blue Anodizing:** Not only provides a sleek aesthetic but also increases the surface emissivity and protects the aluminum from corrosion/oxidation. --- ## Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 5.77 | | **200 (1.0 m/s)** | 2.36 | | **300 (1.5 m/s)** | 1.48 | | **400 (2.0 m/s)** | 1.10 | --- ## Key Features & Applications ### 1. Push-Pin Mounting The unit features pre-drilled holes for push-pins and springs. This ensures a consistent pressure (compression force) against the electronic component, which optimizes the thermal interface material (TIM) performance and prevents the heat sink from shifting during vibration. ### 2. High-Efficiency Fin Design The straight-fin pattern is optimized for **forced air cooling**. The "C2" designation in the part number typically refers to a specific fin density designed to minimize pressure drop while maximizing surface area. ### 3. Target Applications * **Integrated Circuits (ICs):** CPUs, GPUs, and FPGAs. * **Telecommunications:** Network switches and routers. * **Industrial Electronics:** High-power motor drivers or power supplies.