ATS-16D-69-C2-R0
AI

The **ATS-16D-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs.
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### Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | Push-Pin (Spring Loaded) |
| **Base Dimensions** | 45mm x 45mm |
| **Height** | 20mm |
| **Thermal Resistance** | 11.31°C/W (Unducted Flow @ 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### Key Features and Electronic Functionality
#### 1. Thermal Dissipation
The primary purpose of this part is to increase the surface area of a heat-generating electronic component (such as a CPU, FPGA, or power MOSFET). By dissipating heat into the ambient air, it prevents **thermal throttling** and hardware failure.
#### 2. Fin Design (Cross-Cut)
The "69" in the part number refers to a specific fin configuration. This heat sink uses a **straight fin** or **cross-cut** pattern which allows for multidirectional airflow, making it efficient in systems where the direction of the cooling fan might vary.
#### 3. Push-Pin Mounting Mechanism
Unlike adhesive-based heat sinks, the **ATS-16D-69-C2-R0** uses a mechanical push-pin system:
* **Stability:** Provides consistent pressure on the component.
* **Reliability:** Eliminates the risk of the heat sink falling off due to adhesive degradation over time.
* **Ease of Maintenance:** Can be removed and re-installed for component testing.
#### 4. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This material fills microscopic air gaps between the component surface and the heat sink base, significantly lowering the thermal contact resistance.
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### Part Number Breakdown (Nomenclature)
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **16D:** Series/Mounting configuration
* **69:** Fin pattern and profile
* **C2:** Material/Color (Aluminum / Blue Anodized)
* **R0:** Packaging or revision indicator
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What are the PCB hole requirements for mounting this specific push-pin heat sink?
- ⤷ How does the T766 thermal material compare to standard thermal paste in terms of conductivity?
- ⤷ Can this heat sink be used for passive cooling
- ⤷ or does it require a dedicated fan?