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  • ATS-16D-69-C2-R0

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    The **ATS-16D-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Spring Loaded) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | 11.31°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Features and Electronic Functionality #### 1. Thermal Dissipation The primary purpose of this part is to increase the surface area of a heat-generating electronic component (such as a CPU, FPGA, or power MOSFET). By dissipating heat into the ambient air, it prevents **thermal throttling** and hardware failure. #### 2. Fin Design (Cross-Cut) The "69" in the part number refers to a specific fin configuration. This heat sink uses a **straight fin** or **cross-cut** pattern which allows for multidirectional airflow, making it efficient in systems where the direction of the cooling fan might vary. #### 3. Push-Pin Mounting Mechanism Unlike adhesive-based heat sinks, the **ATS-16D-69-C2-R0** uses a mechanical push-pin system: * **Stability:** Provides consistent pressure on the component. * **Reliability:** Eliminates the risk of the heat sink falling off due to adhesive degradation over time. * **Ease of Maintenance:** Can be removed and re-installed for component testing. #### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This material fills microscopic air gaps between the component surface and the heat sink base, significantly lowering the thermal contact resistance. --- ### Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **16D:** Series/Mounting configuration * **69:** Fin pattern and profile * **C2:** Material/Color (Aluminum / Blue Anodized) * **R0:** Packaging or revision indicator
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting this specific push-pin heat sink?
    • ⤷ How does the T766 thermal material compare to standard thermal paste in terms of conductivity?
    • ⤷ Can this heat sink be used for passive cooling
    • ⤷ or does it require a dedicated fan?