The **ATS-16D-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "push-pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 8.69° C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Fin Style** | Straight Fin | --- ## Key Components and Features ### 1. The Heat Sink Body The body is constructed from **Aluminum**, which is chosen for its excellent thermal conductivity and lightweight properties. The **Blue Anodized finish** is not just for aesthetics; it provides surface protection against corrosion and slightly improves heat radiation through increased emissivity. ### 2. Fin Design (Straight Fin) The "70" series design utilizes a straight fin pattern. This is optimized for **forced air cooling** (environments with fans). The spacing between the fins allows air to flow through the channel, stripping heat away from the aluminum surface. ### 3. Attachment Mechanism (Push-Pin) This specific model uses a **Push-Pin and Spring** assembly: * **Precision Springs:** Ensure the heat sink maintains constant pressure on the electronic component (CPU, GPU, or ASIC). * **Plastic Push-Pins:** These snap into pre-drilled holes on the PCB, providing a secure mechanical fit without the need for adhesive tapes. ### 4. Thermal Interface Material (TIM) The "R0" designation usually indicates that the unit comes with **pre-applied Thermal Interface Material**. This is a phase-change material or thermal grease located at the base of the heat sink to fill microscopic air gaps between the component and the sink, maximizing heat transfer. --- ## Common Applications * **Integrated Circuits (ICs):** Cooling microprocessors or chipsets. * **Telecommunications:** Networking hardware that operates under high load. * **Power Electronics:** Cooling MOSFETs or power regulators in industrial settings. ---