The **ATS-16D-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "push-pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-16D-71-C2-R0 | | **Product Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 6.69°C/W @ 100 LFM (Airflow) | --- ## Physical Dimensions The physical footprint is critical for ensuring the part fits within the "keep-out" zones of a PCB design. * **Length (A):** 45.00 mm * **Width (B):** 45.00 mm * **Height (C):** 30.00 mm * **Pitch (E):** 50.00 mm (Distance between mounting holes) * **Pitch (F):** 50.00 mm --- ## Key Components & Features ### 1. Fin Design (Straight Fin) The "71" in the part number identifies the specific fin geometry. This model utilizes a **straight-fin** pattern, which is optimized for high-performance airflow environments where the direction of the air is predictable. ### 2. Push-Pin Mounting Instead of using messy thermal adhesives or complex brackets, this part uses a **push-pin and spring** mechanism. * **Benefit:** Provides consistent pressure (clamping force) across the component, improving thermal transfer. * **Reliability:** Reduces the risk of the heat sink vibrating loose during shipping or operation. ### 3. C2 Material/Thermal Interface The "C2" suffix typically denotes that the heat sink comes pre-applied with a **Thermal Interface Material (TIM)**, usually a high-performance T766 phase-change material or equivalent, ensuring efficient heat transfer from the chip to the aluminum fins. ### 4. Blue Anodized Finish The blue coating is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiation cooling, and protects the aluminum from corrosion. --- ## Applications This specific size (45mm x 45mm) is commonly used to cool: * CPUs and GPUs in embedded systems. * Application Specific Integrated Circuits (ASICs). * Field Programmable Gate Arrays (FPGAs). * High-speed networking chips.