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  • ATS-16D-75-C1-R0

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    The **ATS-16D-75-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 1.47°C/W (at 100 LFM) | | **Dimensions (L x W)** | 25.00mm x 25.00mm | | **Height** | 30.00mm | --- ### 2. Key Design Elements #### A. Fin Profile (Straight Fin) The "75" in the part number indicates the specific fin design. Straight fins are ideal for high-velocity airflow environments where air can be forced through the channels effectively. #### B. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiative heat transfer and protecting the aluminum from corrosion. #### C. Attachment Mechanism (Push-Pin) This model uses a **plastic push-pin with a compression spring**. * **Reliability:** Provides consistent pressure on the component (TIM - Thermal Interface Material). * **Installation:** Requires pre-drilled holes in the PCB. The spring ensures that the heat sink maintains contact even during mechanical vibration. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **16D** | Series/Product Family (pushPIN™ Aluminum) | | **75** | Specific Fin Pattern/Geometry | | **C1** | Material/Color (Aluminum, Blue Anodized) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Thermal Performance Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). A lower number means better cooling. For the ATS-16D-75-C1-R0: * **At 100 LFM (Linear Feet per Minute):** ~1.47 °C/W * **At 500 LFM:** Performance improves significantly (drops to ~0.70 °C/W) as airflow velocity increases.
    ✨ Follow-up Questions
    • ⤷What is the hole pattern spacing for this heat sink on a PCB?
    • ⤷ Does this part come with a pre-applied thermal interface material (TIM)?
    • ⤷ What are the alternatives to push-pin mounting for this size?