ATS-16D-75-C1-R0
AI

The **ATS-16D-75-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 1.47°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 25.00mm x 25.00mm |
| **Height** | 30.00mm |
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### 2. Key Design Elements
#### A. Fin Profile (Straight Fin)
The "75" in the part number indicates the specific fin design. Straight fins are ideal for high-velocity airflow environments where air can be forced through the channels effectively.
#### B. Material and Coating
* **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio.
* **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiative heat transfer and protecting the aluminum from corrosion.
#### C. Attachment Mechanism (Push-Pin)
This model uses a **plastic push-pin with a compression spring**.
* **Reliability:** Provides consistent pressure on the component (TIM - Thermal Interface Material).
* **Installation:** Requires pre-drilled holes in the PCB. The spring ensures that the heat sink maintains contact even during mechanical vibration.
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### 3. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **16D** | Series/Product Family (pushPIN™ Aluminum) |
| **75** | Specific Fin Pattern/Geometry |
| **C1** | Material/Color (Aluminum, Blue Anodized) |
| **R0** | RoHS Compliant / Revision code |
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### 4. Thermal Performance
Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). A lower number means better cooling. For the ATS-16D-75-C1-R0:
* **At 100 LFM (Linear Feet per Minute):** ~1.47 °C/W
* **At 500 LFM:** Performance improves significantly (drops to ~0.70 °C/W) as airflow velocity increases.
- ⤷What is the hole pattern spacing for this heat sink on a PCB?
- ⤷ Does this part come with a pre-applied thermal interface material (TIM)?
- ⤷ What are the alternatives to push-pin mounting for this size?