The **ATS-16D-76-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, specifically designed for cooling integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Heat Sink Type** | Push-Pin / Fine Pitch | | **Material** | Aluminum | | **Dimensions** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 2.73°C/W (@ 100 LFM) | | **Attachment Method** | Plastic Push-Pin (Spring Loaded) | | **Fin Style** | Straight (High-density) | | **Finish** | Blue Anodized | --- ### 2. Component Features * **Push-Pin Mounting:** This part utilizes a standardized push-pin mechanism. This allows for secure attachment to the PCB without the need for adhesive tapes, ensuring better thermal contact and mechanical stability. * **High-Density Fin Design:** The "76" in the part number indicates a specific fin pattern designed to maximize surface area within a small 25mm footprint, ideal for space-constrained electronics. * **Material Efficiency:** Made from extruded aluminum (6063), it offers a balance of lightweight construction and high thermal conductivity. * **Thermal Interface Material (TIM):** Typically, "C2" suffix variants come with a pre-applied thermal interface material (like T766) to ensure low contact resistance between the heat source and the sink. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its role in a circuit: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (The Brand) | | **16D** | Series / Frame size identifier | | **76** | Specific Fin and Performance configuration | | **C2** | Thermal Interface Material (TIM) type / Coating | | **R0** | RoHS Compliant / Revision status | --- ### 4. Applications The ATS-16D-76-C2-R0 is commonly found in: 1. **Telecommunications:** Cooling small chips on network switches or routers. 2. **Embedded Systems:** Thermal management for ARM-based processors. 3. **Industrial Controls:** Protecting sensors or controllers from overheating in enclosed environments.