The **ATS-16D-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Brass pins / Plastic pins) | | **Thermal Resistance (Flowing Air)** | 20.11 °C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | 20.11 °C/W (Performance varies by airflow) | | **Fin Style** | Straight Fin | --- ### 2. Design and Component Breakdown #### A. The maxiFLOW™ Geometry The unique "flared" fin design is engineered to maximize surface area for convection cooling while minimizing pressure drop. This is critical in high-density electronic enclosures where airflow is restricted. #### B. pushPIN™ Attachment System Instead of simple adhesives, this part uses the **pushPIN™** system: * **Spring-loaded mechanism:** Ensures a precise and consistent pressure on the electronic component, which improves thermal interface performance. * **Compression Springs:** Available in various materials (Stainless steel/Brass) to provide the necessary force. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates that this unit typically comes with **T766** pre-applied thermal phase-change material. This ensures that micro-gaps between the chip and the heat sink are filled for optimal heat transfer. --- ### 3. Part Number Decoder Understanding the "Electronic DNA" of this part: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16D**: Product Series (maxiFLOW). * **85**: Specific profile/fin height configuration. * **C3**: Thermal Interface Material (T766) and color/finish designation. * **R0**: Revision code or packaging standard. --- ### 4. Typical Applications This component is used in electronic systems where space is limited but heat density is high: 1. **Telecommunications**: Cooling line cards and routers. 2. **Embedded Systems**: Industrial PC processors. 3. **Power Supplies**: Dissipating heat from MOSFETs or IGBTs.